{"id":1204,"date":"2020-04-22T20:49:19","date_gmt":"2020-04-22T20:49:19","guid":{"rendered":"http:\/\/sites.rutgers.edu\/nb-senior-exhibits\/?page_id=1204"},"modified":"2020-05-20T03:18:16","modified_gmt":"2020-05-20T03:18:16","slug":"cleeman-jeremy-hybrid-additive-manufacturing-of-embedded-electronics","status":"publish","type":"page","link":"https:\/\/sites.rutgers.edu\/nb-senior-exhibits\/partners\/aresty-research-virtual-symposium-2020\/cleeman-jeremy-hybrid-additive-manufacturing-of-embedded-electronics\/","title":{"rendered":"Cleeman, Jeremy: Hybrid Additive Manufacturing of Embedded Electronics"},"content":{"rendered":"<p><a href=\"http:\/\/sites.rutgers.edu\/nb-senior-exhibits\/wp-content\/uploads\/sites\/442\/2020\/04\/Cleeman_Jeremy.pdf\" target=\"_blank\" rel=\"noopener noreferrer\"><img loading=\"lazy\" decoding=\"async\" class=\"size-medium wp-image-653 alignleft\" src=\"http:\/\/sites.rutgers.edu\/nb-senior-exhibits\/wp-content\/uploads\/sites\/442\/2020\/04\/Cleeman_Jeremy_thumbnail-300x225.png\" alt=\"Jeremy Cleeman thumbnail\" width=\"300\" height=\"225\" srcset=\"https:\/\/sites.rutgers.edu\/nb-senior-exhibits\/wp-content\/uploads\/sites\/442\/2020\/04\/Cleeman_Jeremy_thumbnail-300x225.png 300w, https:\/\/sites.rutgers.edu\/nb-senior-exhibits\/wp-content\/uploads\/sites\/442\/2020\/04\/Cleeman_Jeremy_thumbnail-1024x768.png 1024w, https:\/\/sites.rutgers.edu\/nb-senior-exhibits\/wp-content\/uploads\/sites\/442\/2020\/04\/Cleeman_Jeremy_thumbnail-768x576.png 768w, https:\/\/sites.rutgers.edu\/nb-senior-exhibits\/wp-content\/uploads\/sites\/442\/2020\/04\/Cleeman_Jeremy_thumbnail.png 1067w\" sizes=\"(max-width: 300px) 100vw, 300px\" \/><\/a><\/p>\n<p><strong><a class=\"btn btn-primary\" href=\"https:\/\/rutgers.box.com\/s\/xaal0t10fgk5pt7ivzqbc59r194yw2zd\" target=\"_blank\" rel=\"noopener noreferrer\">View video presentation<\/a><a href=\"https:\/\/sites.rutgers.edu\/nb-senior-exhibits\/wp-admin\/post-new.php?post_type=page\">Add New<\/a><\/strong><\/p>\n<p><strong>Title:<\/strong> Hybrid Additive Manufacturing of Embedded Electronics<\/p>\n<p><strong>Name:<\/strong> Jeremy Cleeman<\/p>\n<p><strong>Major:<\/strong> Mechanical Engineering<\/p>\n<p><strong>School affiliation:<\/strong> School of Engineering<\/p>\n<p><strong>Programs:<\/strong> Aresty &#8211; Research or Conference Funding Recipient<\/p>\n<p><strong>Other contributors:<\/strong> Rajiv Malhotra<\/p>\n<p><strong>Abstract:<\/strong> Combining metal nanoparticle printing with polymer additive manufacturing has the potential to enable the manufacturing of devices with embedded electronic elements. State-of-the-art manufacturing processes offer a trade off between circuit resistivity or polymer damage. The goal of this work is to significantly decrease interconnect resistivity without damaging the substrate. In order to accomplish this goal we explore the mechanisms of Fused Filament Fabrication (FFF) of Acrylonitrile Butadiene Styrene (ABS), printing of silver NPs and out-of-chamber Intense Pulsed Light (IPL) sintering of the printed circuits. While attempting to achieve appropriate levels of circuit resistance, IPL of only-nanosphere based circuits lead to thermal damage of the polymer. However, a combination of both Ag nanospheres and nanowires achieves a resistivity several times lower than state-of-the-art (13.1 \u03bc\u03a9-cm or 8 x bulk silver) without any polymer damage. This circuit was sintered within 0.75 s of IPL<\/p>\n","protected":false},"excerpt":{"rendered":"<p>View video presentationAdd New Title: Hybrid Additive Manufacturing of Embedded Electronics Name: Jeremy Cleeman Major: Mechanical Engineering School affiliation: School of Engineering Programs: Aresty &#8211; Research or Conference Funding Recipient &hellip; <a href=\"https:\/\/sites.rutgers.edu\/nb-senior-exhibits\/partners\/aresty-research-virtual-symposium-2020\/cleeman-jeremy-hybrid-additive-manufacturing-of-embedded-electronics\/\" class=\"\">Read More<\/a><\/p>\n","protected":false},"author":970,"featured_media":0,"parent":441,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"template-custom.php","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-1204","page","type-page","status-publish","hentry"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v23.5 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Cleeman, Jeremy: Hybrid Additive Manufacturing of Embedded Electronics - 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