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Capabilities and Charges

Fabrication Tools

  • Atomic Layer Deposition
  • Ebeam (Liquid N2)
  • Ebeam (Angstorm)
  • Ion Milling (Angstorm)
  • PECVD_Plasma Therm
  • PECVD_Unaxis
  • Trion Reactive Ion Etch
  • Plasma Treatment_Barrel Etcher
  • Rapid Thermal Anneal
  • Sputter_Denton-DV502
  • Sputter_Sys & Des Fab
  • Furnace_Boron
  • Furnace_Phosphorus
  • Furnace_Oxidation
  • Furnace_Anneal/FGA
  • Box Furnace (Thermcraft)_O2 and N2 only
  • Box Furnace (ThermoScientific)_FGA and N2 only
  • UVozone Cleaner
  • Polisher/Grinder
  • Laser Scribing, Marking and Ablation (Innotech)
  • Thermal Evaporator (Logitek)
  • Wafer Spin Rinse Dryer
  • Photoresist Spinner (Laurel)
  • Mask Aligner (Karl-Suss MJB3)

Wet Chemical Process

  • Silicon Etch (HF:HNO3)
  • Silicon Etch (TMAH)
  • Silicon Surface Texturing (TMAH)
  • Caro Etch (H2SO4:H2O2)
  • Aluminum Etch (H4PO4:HNO3:CH3COOH)
  • RCA Clean (NH3:H2O2:H2O, HCL:H2O2:H2O)
  • Palladium Etch (CH3COOH:HNO3:HCL)
  • Boiling HNO3 for oxide growth
  • Buffered Oxide Etch
  • Silver Etch (HNO3)
  • Oxide/Nitride Etch (HF fume)

Characterization Tools

  • Detek Non-Contact Profilometer
  • UV-Vis-NIR Spectroscopy
  • Photoluminescence (PL) Spectroscopy
  • Photoconductance (PCD), SunsVoc
  • LCR Meter
  • Ellipsometry
  • Contact Resistivity Measurement
  • 4-Point-Probe (Ossila)
  • Film Metric
  • Optical Microscope
  • UV & Solar Simulator
  • Scanning Electron Microscope (SEM)
  • Energy Dispersive Spectroscopy (EDS)
  • Electron-Beam Lithography (EBL)

 

Rutgers Non-Rutgers Corporate
1 Atomic Layer Deposition  $                  40  $                  65  $                  85
2 Ebeam (Liquid N2)  $                  35  $                  55  $                  75
3 Ebeam (Angstorm)  $                  45  $                  65  $                  85
4 Ion Milling (Angstorm)  $                  45  $                  65  $                  85
5 PECVD (Plasma Therm)  $                  40  $                  60  $                  80
6 PECVD (Unaxis)  $                  40  $                  60  $                  80
7 Reactive Ion Etch (Trion)  $                  40  $                  60  $                  80
8 Rapid Thermal Anneal  $                  25  $                  45  $                  65
9 Plasma Etcher (Low Vac)  $                  25  $                  45  $                  65
10 Sputter (Denton-Explorer)  $                  35  $                  55  $                  75
11 Sputter (Sys & Des Fab)  $                  35  $                  55  $                  75
12 Furnace (Boron)  $                  50  $                  70  $                  90
13 Furnace (Phosphorus)  $                  50  $                  70  $                  90
14 Furnace (Oxidation)  $                  50  $                  70  $                  90
15 Furnace (Anneal/FGA)  $                  50  $                  70  $                  90
16 Box Furnace (Thermcraft)_O2 and N2 only  $                  35  $                  55  $                  75
17 Box Furnace (ThermoScientific)_FGA and N2 only  $                  35  $                  55  $                  75
20 Laser Scribing, Marking and Ablation (Innotech)  $                  15  $                  35  $                  55
21 Ozone Dissolved Deionized Water  $                  35  $                  55  $                  75
22 Wafer Spin Rinse Dryer  *  *  *
23 Lithography (Resist Spinner, Mask Aligner, Bake, Developing)  $                  45  $                  65  $                  85
24 Lithography (Partial) — Mask Aligner only  $                  20  $                  40  $                  60
25 Lithography (Partial) — Spin Resist and Bake only  $                  20  $                  40  $                  60
26 Lithography (Partial) — Wet Benches for Resist Development and Strip  $                  20  $                  40  $                  60
27 Wet Bench_Stainless Steel (Solvent Only)  $                  20  $                  40  $                  60
28 Wet Bench #1 (Surface Clean Application)  $                  20  $                  40  $                  60
29 Wet Bench #2 (Cr or Au Etching)  $                  35  $                  55  $                  75
30 Wet Bench #3 (FeCl3 only)  $                  25  $                  45  $                  65
31 Detek Non-Contact Profilometer  $                  25  $                  45  $                  65
32 Ultra Tech Mask Cleaner  *  *  *
33 4-Point-Probe (Ossila)  $                  25  $                  45  $                  65
34 Film Metric  $                  25  $                  45  $                  65
35 Optical Microscope  *  *  *
36 UV & Solar Simulator  $                  35  $                  55  $                  75
37 Sinton Carrier Lifetime Tester  $                  25  $                  45  $                  65
38 Film Sense Ellipsometry  $                  25  $                  45  $                  55
39 Scanning Electron Microscope  $                  45  $                  65  $                 85
40 Electron-beam Lithography EBL (including PMMA Spin, Bake and Develop)  $                  70  $                  90  $                 100
41 Electron-beam Lithography EBL only (without PMMA Spin, Bake and Develop)  $                  55  $                  75  $                  95
42 Cleanroom Access (flat rate the whole day)  $                  15  $                  35  $                  45
* included in the cleanroom access fee
add $25/hr for processes requiring cleanroom staff’s assistance
Non-Rutgers includes academic institutes and startup companies
Unlimited cleanroom access and usage fee for the whole year is $5,000/per person.